3M™ 7100168441 442KW Tape, 4 mil THK, Polyester, Rubber Adhesive, Transparent
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Features
- Rubber based adhesive provides fast, reliable bonding strength and removes cleanly
- Attaches polishing pads to platens for chemical mechanical planarization (CMP) in semiconductor manufacturing
- Release liner adds dimensional stability for fast and efficient conversion
- Adhesive is applied to film carrier on both sides for effective lamination to pads and clean removal from platens
- Also applicable for polishing pad attachment to platens in HDD and glass manufacturing
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Description
3M™, 7100168441, Tape, Series: 442KW, 4 mil Thickness, Polyester, Transparent, Rubber Adhesive, 158 deg F Maximum Operating, 5 deg F Minimum Operating
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