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Scotch-Weld™ B5005282002 Adhesive

Selected Scotch-Weld_7100244859.jpg
Scotch-Weld_7100244859.jpg

Features

  • KEY SUBSTRATES - Adheres to a variety of substrates, including those that are slightly oily
  • HIGHLY FLEXIBLE - Has a structural adhesive offering greater than 200 Percent elongation
  • HIGH-PERFORMANCE - Minimizes bond-line read-through and cure shrinkage to enable the use of thinner panels
  • TIME TO ADJUST - Allows between 20-30 min before the product is fixed in place
  • FAST-HANDLING - Offers handling strength in approximately 35-40 min
  • CURING TIME - Fully cured in 24 hr at a temperature of 73 deg F (23 deg C)
  • KEY SPECIFICATIONS - Nonflammable classification and low-odor formulation
  • PRODUCT OPTIONS - Available in bulk form or a Duo-Pak (DP)

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