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3M™ Thermally Conductive Interface Pad, 155 mm L x 210 mm W, Silicon Adhesive, Filled Silicon Polymer Backing, Gray

Selected 3M_051115_24082.jpg
3M_051115_24082.jpg

Features

  • Good dielectric properties
  • Very high thermal conductivity (4.9 with m-K)
  • Slight tack allows pre-assembly
  • Good softness and conformability even to non-flat surfaces
  • Good wettability for better thermal conductivity

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