3M™ Thermally Conductive Interface Pad, 155 mm L x 210 mm W, Silicon Adhesive, Filled Silicon Polymer Backing, Gray
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Features
- Good dielectric properties
- Very high thermal conductivity (4.9 with m-K)
- Slight tack allows pre-assembly
- Good softness and conformability even to non-flat surfaces
- Good wettability for better thermal conductivity
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